P O W E N C Y

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Services Details

All Services

Opening Hours

  • Mon - Sat: 10.00 AM - 4.00 PM
  • Sun: 09.00 AM - 4.00 PM
  • Friday: Closed
  • Emergency: 24 hours

Need Help? Call Here

+208-555-0112
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Semi Fab & OSAT Expert

Overview

Semiconductor fabrication (commonly known as "semi fab") and OSAT (Outsourced Semiconductor Assembly and Test) are essential components of the chip manufacturing ecosystem. Semiconductor fabs are facilities where microchips are manufactured with precision using advanced processes and cleanroom environments. Once the silicon chips are created, OSAT providers handle packaging, assembly, and final testing, ensuring the chips are production-ready.

What We Offer

We deliver end-to-end support across both semiconductor fabrication and OSAT operations. Our services are designed to help businesses optimize chip production, reduce time to market, and ensure quality at every stage. Key offerings include:

  • Technology consultation to select the right foundry and process node
  • Design-to-fabrication management for smooth tape-out execution
  • Packaging and test coordination with leading OSAT providers
  • Yield analysis and improvement strategies
  • Compliance and reliability validation aligned with industry standards

Industries We Serve

Our expertise spans a wide range of applications, supporting clients from startups to established semiconductor firms across the globe. We cater to:

  • Consumer electronics
  • Automotive electronics
  • Industrial systems and automation
  • Mobile and IoT device manufacturers
  • Telecommunications and networking equipment
  • Medical and healthcare technology providers

Why Partner with Us

Choosing the right partner for semi fab and OSAT management is critical. We bring:

  • Extensive industry knowledge from silicon to system integration
  • A global network of trusted fabs and OSATs
  • Customized solutions tailored to your product needs
  • Streamlined development workflows that speed up production cycles
  • A transparent, collaborative approach from concept to completion

Our Process

We guide clients through every step of semiconductor manufacturing and assembly:

  1. Requirement Analysis – Understanding your product and goals
  2. Foundry Selection – Identifying the best fabrication partner for your needs
  3. Tape-Out Coordination – Managing the transition from design to silicon
  4. Packaging Strategy – Defining the optimal package type based on application
  5. Testing and QA – Ensuring reliability, performance, and compliance
  6. Production Support – Ongoing assistance through ramp-up and beyond
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Most Comment Question?

Explore key insights into semiconductor fabrication and OSAT—from cleanroom chip creation to advanced packaging and testing solutions. Gain clarity on common industry practices and challenges.

A semiconductor fab manufactures chips on silicon wafers using processes like photolithography and etching. OSAT providers handle post-fab steps—packaging and testing—ensuring that chips are protected and function correctly before reaching end users.
Outsourcing to OSAT providers allows semiconductor companies to reduce capital expenditure, access advanced packaging technologies, and scale production quickly. It also enables fabless companies to focus on chip design while leaving manufacturing tasks to specialists.
Choosing the right OSAT partner depends on factors like your chip’s complexity, required packaging type, production volume, testing needs, and time-to-market goals. A strategic evaluation of capabilities and track record is essential.
A team with experience in both fab and OSAT ensures smooth transitions between wafer production and final packaging/testing. This leads to fewer delays, higher yields, and better quality control across the entire chip development lifecycle.